STMicroelectronics is a French-Italian multinational electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. It is commonly called ST, and it is Europe's largest semiconductor chip maker based on revenue. While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands.

The company's US headquarters is in Coppell, Texas. Headquarters for the Asia-Pacific region is in Singapore whilst Japan and Korea operations are headquartered in Tokyo. The company headquarters for the Greater China region is in Shanghai.[1]

STMicroelectronics N.V.
Naamloze vennootschap
Traded asBITSTM
CAC 40 Component
as Società Generale Semiconduttori, 1987 as SGS-Thomson
Key people
Jean-Marc Chery (President and CEO), Nicolas Dufourcq (Chairman of the supervisory board)
ProductsIntegrated circuits for specific applications, memory (including EEPROM), microcontrollers, transistors, smartcards
RevenueUS$9.66 billion (2018)
Number of employees
45,500 (December 2017)


ST was formed in 1987 by the merger of two government-owned semiconductor companies: SGS Microelettronica (Società Generale Semiconduttori) of Italy and Thomson Semiconducteurs, the semiconductor arm of France's Thomson:

SGS Microelettronica originated in 1972 from a previous merger of two companies:

  • ATES (Aquila Tubi e Semiconduttori), a vacuum tube and semiconductor maker headquartered in the Abruzzese city of l'Aquila, which in 1961 changed its name to Azienda Tecnica ed Elettronica del Sud and relocated its manufacturing plant to the outskirts of the Sicilian city of Catania
  • Società Generale Semiconduttori (founded in 1957 by Adriano Olivetti).

Thomson Semiconducteurs was created in 1982 by the French government's widespread nationalisation of industries. It included:

At the time of the merger the company was named SGS-THOMSON but took its current name in May 1998 following Thomson’s sale of its shares. After its creation ST was ranked 14th among the top 20 semiconductor suppliers with sales of around US$850 million. The company has participated in the consolidation of the semiconductor industry since its formation, with acquisitions including:

  • In 1989, British company Inmos known for its transputer microprocessors from parent Thorn EMI.
  • In 1994, Canada-based Nortel's semiconductor activities.
  • In 2002, Alcatel's Microelectronics division, which along with the incorporation of smaller ventures such as UK company, Synad Ltd, helped the company expand into the Wireless-LAN market.
  • In 2007, US-based Genesis Microchip.[2] Genesis Microchip is known for their strength in video processing technology (Faroudja) and has design centres located in Santa Clara, Toronto, Taipei City, Taiwan R.O.C. and Bangalore.

On December 8, 1994, the company completed its initial public offering on the Paris and New York stock exchanges. Owner Thomson SA sold its stake in the company in 1998 when the company also listed on the Borsa Italiana in Milan.

In 2002, Motorola and TSMC joined ST and Philips in a new technology partnership. The Crolles2 Alliance was created with a new 12" wafer manufacturing facility located in Crolles (France).

By 2005, ST was ranked fifth, behind Intel, Samsung, Texas Instruments and Toshiba, but ahead of Infineon, Renesas, NEC, NXP, and Freescale. The company was the largest European semiconductors supplier, ahead of Infineon and NXP.

Early in 2007, NXP (formerly Philips Semiconductors) and Freescale (formerly Motorola Semiconductors) decided to stop their participation in Crolles2 Alliance. Under the terms of the agreement the Alliance came to an end on December 31, 2007.[3]

On May 22, 2007, ST and Intel created a joint venture in the memory application called Numonyx. This new company merged ST and Intel Flash Memory activities.

Semiconductor market consolidation continued with ST and NXP announcing on April 10, 2008, the creation of a new joint venture of their mobile activities, with ST owning 80% of the new company and NXP 20%. This joint venture began on August 20, 2008.

On February 10, 2009, ST Ericsson, a joint venture bringing together ST-NXP Wireless and Ericsson Mobile Platforms, was established.[4]

In 2011, ST announced the creation of a joint lab with Sant'Anna School of Advanced Studies. The lab will focus on research and innovation in bio-robotics, smart systems and microelectronics.[5] Past collaborations with Sant'Anna School of Advanced Studies included DustBot, a platform that integrated self-navigating "service robots" for waste collection.[5]

ST Ericsson was a multinational manufacturer of wireless products and semiconductors, supplying to mobile device manufacturers.[6] ST-Ericsson was a 50/50 joint venture of Ericsson and STMicroelectronics established on February 3, 2009, and dissolved on August 2, 2013. Headquartered in Geneva, Switzerland, it was a fabless company, outsourcing semiconductor manufacturing to foundry companies.


As of December 31, 2014, the shareholders were:[7]

Company structure

Following an earlier failure, STMicroelectronics has stayed out of the volatile markets for DRAM and PC microprocessors. In 1994, it attempted to launch compatible Intel 80486 microprocessors in partnership with American company Cyrix. Only model one was completed, the 1995 Cyrix M1 microprocessor, which was intended to compete with Intel's Pentium family.

It did achieve some success, however, in the PC-compatible x86 embedded systems market with its STPC SoC line, culminating in the 486-class STPC Atlas, which reached end-of-life in 2008.

Manufacturing facilities

Unlike so-called fabless semiconductor companies, STMicroelectronics owns and operates its own semiconductor wafer fabs. The company owned five 8 inch (200 mm) wafer fabs and one 12 inch (300 mm) wafer fab in 2006. Most of the production is scaled at 0.18 µm, 0.13 µm, 90 nm and 65 nm (measurements of transistor gate length). STMicroelectronics also owns back-end plants, where silicon dies are assembled and bonded into plastic or ceramic packages.[8]

Major sites include:

Grenoble, France

Grenoble is one of the company's most important R&D centres, employing around 4,000 staff. The Polygone site employs 2200 staff and is one of the historical bases of the company (ex SGS). All the historical wafer fab lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and an important R&D center, focused on silicon and software design and fab process development.

The Crolles site hosts a 200 mm (8 in) and a 300 mm (12 in) fab and was originally built as a common R&D center for submicrometre technologies as part of the 1990 Grenoble 92 partnership between SGS-Thomson and CNET, the R&D center of French telecom company France Telecom. The 200 mm (8 in) fab, known as Crolles 1, is the company's first and was built as part of a 1991 partnership between SGS-Thomson and Philips to develop new manufacturing technologies. Crolles 1 was opened on September 9, 1993 by Gérard Longuet, French minister for industry.

The 300 mm (12 in) fab was inaugurated by French president Jacques Chirac, on February 27, 2003. It includes a R&D center which focuses on developing new nanometric technology processes for 90 nm to 32 nm scale using 300 mm (12 in) wafers and it was developed for The Crolles 2 Alliance'. This alliance of STMicroelectronics, TSMC, NXP Semiconductors (formerly Philips semiconductor) and Freescale (formerly Motorola semiconductor) partnered in 2002 to develop the facility and to work together on process development. The technologies developed at the facility were also used by global semiconductor foundry TSMC of Taiwan, allowing TSMC to build the products developed in Crolles on behalf of the Alliance partners who required such foundry capacity. A new fab is under construction since 2015.

Rousset, France

Employing around 3,000 staff, Rousset hosts several division headquarters including smartcards, microcontrollers, and EEPROM as well as several R&D centers. Rousset also hosts an 8-inch (200 mm) fab which was opened on May 15, 2000 by French prime minister Lionel Jospin.

The site opened in 1979 as a 100 mm (3.9 in) fab operated by Eurotechnique, a joint venture between Saint-Gobain of France and National Semiconductor of the US. Rousset was sold to Thomson-CSF in 1982 as part of the French government's 1981-82 nationalization of several industries. As part of the nationalisation, a former Thomson plant in the center of Aix-en-Provence operating since the 1960s was closed and staff were transferred to the new Rousset site. The original 100 mm (4 in) fab was upgraded into 130 mm (5 in) and later 150 mm (6 in) fab in 1996. It is now being shut down.

In 1988, a small group of employees from the Thomson Rousset plant (including the director, Marc Lassus) founded a start-up company, Gemalto (formerly known as Gemplus) which became a leader in the smartcard industry.

Tours, France

Employing 1,500 staff, this site hosts a fab and R&D centers.

Milan, Italy

Employing 6,000 staff, the Milan facilities match Grenoble in importance. Agrate Brianza, employs around 4000 staff and is a historical base of the company (ex SGS). The site has several fab lines (including an 300 mm (12 in) fab) and an R&D center. Castelletto, employs 300 to 400 staff and hosts some divisions and R&D centers.

Update-2012: Numonyx JV (with Intel) is acquired by Micron As such, R2 Fab (Agrate previous R&D 200mm Fab) is currently a Micron entity

Catania, Italy

The Catania plant in Sicily employs 5,000 staff and hosts several R&D centers and divisions, focusing on flash memory technologies as well as two fabs. The plant was launched in 1961 by ATES to supply under licensing to RCA of the US and initially using Germanium. The site's two major wafer fabs are a 200 mm (8 in) fab, opened in April 1997 by Romano Prodi, president of the Italian council and a 300 mm (12 in) fab that has never been completed and which was transferred in its current state to Numonyx in 2008.

Kirkop, Malta

As of 2010, ST employed some 1,500 people in Kirkop, making it the largest private sector employer, and the country's leading exporter.[9]

Ang Mo Kio, Singapore

In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first wafers in 1984. Converted up to 200 mm (8 in) fab, this is now an important 200 mm (8 in) wafer fab of the group. Ang Mo Kio also hosts some design centers. The site currently employs 6000 staff.

Update-2012: Numonyx JV (with Intel) is acquired by Micron in 2010. As such, AMK8 Fab (200mm HVM Fab) is currently a Micron entity. AMK5 and AMK6 remains to be STM entities.

Tunis, Tunisia

Application, design and support. about 110 employees. Divisions: MCD

Other sites

Administrative headquarters

  • Geneva, Switzerland: Corporate headquarter which hosts most of the ST top management. It totals some hundred of employees.
  • Saint-Genis-Pouilly, France, near Geneva: A few hundred of employees. Headquarters for logistics.
  • Paris: Marketing and support.

Assembly plants

  • Malta: In 1981, SGS-Thomson (now STMicroelectronics) built its first assembly plant in Malta. STMicroelectronics is, as of 2008, the largest private employer on the island, employing around 1,800 people.
  • Muar, Malaysia: around 4000 employees. This site was built in 1974 by Thomson and is now an assembly plant.
  • Shenzhen, Guangdong province, China, near Hong Kong: In 1994, ST and the Shenzhen Electronics Group signed a partnership to construct and jointly operate an assembly plant (ST has majority with 60%). The plant is located in Futian Free Trade Zone and became operational in 1996. It has around 3,300 employees. A new assembly plant is built in Longgang since 2008, and closed up till 2014. The R&D, design, sales and marketing office is located in the Hi-tech industrial park in Nanshan district.
  • Calamba City, in the province of Laguna, Philippines,: In 2008, ST acquired this plant from NXP Semiconductors. Initially as part of joint venture with NXP but later acquired the whole share turning it into a full-fledged STMicroelectronics Assembly and Testing plant. Currently it employs 2,000 employees.

Design centers

  • Rabat, Morocco: A design center that employs 160 people.
  • Naples, Italy: A Design center employing 300 people.
  • Lecce, Italy: HW & SW Design Center which hosts 20 researchers in the Advanced System Technology group.
  • Ang Mo Kio, Singapore: In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh. Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first wafers in 1984. Converted up to 8 inch (200 mm) fab, this is now an important 8 inch (200 mm) wafer fab of the ST group. Ang Mo Kio also hosts design centers for various groups.
  • Greater Noida, India: The Noida site was launched in 1992 to conduct software engineering activities. A silicon design center was inaugurated on February 14, 1995. With 120 employees, it was the largest design center of the company outside Europe at the time. In 2006, the site was shifted to Greater Noida for further expansion. The site hosts mainly design teams. It is now primarily involved with the design of home video products (Set-Top Box, DVD), GPS and Wireless LAN chips, and accompanying software. Worldwide Data center support is also transferred to Greater Noida in 2004. The employee strength in Greater Noida is around 2000. This also includes employees of ST-Ericsson.
  • Santa Clara, California, (Silicon Valley), United States: 120 staff in marketing, design and applications.
  • La Jolla, California, (San Diego, United States): 80 staff in design and applications.
  • Lancaster, Pennsylvania, U.S.: Application, support, and marketing.
  • Prague, Czech Republic: 100 to 200 employees. Application, design and support.
  • Tunis, Tunisia: 110 employees. Application, design and support.
  • Sophia Antipolis, near Nice, France: Design center with a few hundred employees.
  • Edinburgh, Scotland: 200 staff focused in the field of imaging.
  • Ottawa, Ontario, Canada: In 1993, SGS-Thomson purchased the semiconductor activities of Nortel which owned in Ottawa an R&D center and a fab. The fab was closed in 2000, however, a design, R&D centre and sales office is operating in the city.
  • Toronto, Ontario, Canada: HW & SW Design Center primarily involved with the design of video processor ICs as part of ST's TVM Division.
  • Palermo, Sicily, Italy: Design Center.
  • Bangalore, India: HW and SW design center employing more than 250 people (Including the employees of ST Ericsson and Genesis Microchip).
  • Zaventem, Belgium: 100 employees. Design & Application Center. Closed in 2013
  • Helsinki, Finland: Design Center.
  • Turku, Finland: Design Center.
  • Oulu, Finland: Design Center.
  • Tampere, Finland: Design Center.
  • Longmont, Colorado USA: Design Center.
  • Graz, Austria: NFC Competence Center.[10]

Closing sites

The Phoenix, Arizona 8 inch (200 mm) fab, the Carrollton, Texas 6 inch (150 mm) fab, and the Ain Sebaa, Morocco fab are beginning rampdown plans, and are destined to close by 2010.[11]

The Casablanca, Morocco site consists of two assembly parts (Bouskoura and Aïn Sebaâ) and totals around 4000 employees. It was opened in the 1960s by Thomson.

The Bristol, United Kingdom site employing well over 300 at its peak (in 2001/2) but was ramped down to approx. 150 employees at close by early 2014.

The Ottawa, Ontario, Canada plant (approx. 450 employees) will close down by 2013 end.[12]

Closed sites

  • Rennes, France hosted a 6-inch (150 mm) fab and was closed in 2004
  • Rancho Bernardo, California, a 4-inch (100 mm) fab created by Nortel and purchased by SGS-Thomson in 1994, after which it was converted into a 6-inch (150 mm) fab in 1996.
  • SGS's first presence in the US was a sales office based in Phoenix in the early 1980s. Later, under SGS-Thomson, an 8-inch (200 mm) fab was completed in Phoenix in 1995. The company's second 8" fab after Crolles 1, the site was first dedicated to producing microprocessors for Cyrix. On July 10, 2007, ST said that it would close this site, and in July 2010 the shell of the Phoenix PF1 FAB was bought by Western Digital Corporation.[11]
  • The Carrollton, Texas site was built in 1969 by Mostek, an American company founded by former employees of Texas Instruments. In 1979, Mostek was acquired by United Technologies which sold it to Thomson Semiconducteurs in 1985. Initially equipped with a 4-inch (100 mm) fab, it was converted into a 6-inch (150 mm) fab in 1988. The Colorado Springs activities of British company INMOS were transferred to Carrolton in 1989 following its acquisition by SGS Thomson. Since then the site has been refocused to wafer testing. On July 10, 2007, ST announced it would close this fab, and it was finally closed in 2010.[11]
  • Bristol, UK This R&D site housed the British company Inmos which in 1978 began development of the famous Transputer microprocessor. The site was acquired with Inmos in 1989, and was primarily involved with the design of home video and entertainment products (e.g. Set-Top Box), GPS chips, and accompanying software. At its peak the site employed more than 250 employees. The site officially closed on March 31, 2014.[13]

Future locations

  • On August 8, 2007, ST bought Nokia's microchip development team and plans to invest heavily in development of cellular ASIC applications. The purchase included Nokia's ASIC team in Southwood (UK) and the company plans several sites in Finland.[14][15][16]

Solar cells

STMicroelectronics is involved in a project to produce plastic solar cells that employ a matrix of carbon nanotubes to convert photons to electrical power.[17]

See also


  1. ^ ChinaTechNews. "STMicroelectronics Launches New China Headquarters In Shanghai." Apr 11, 2008. Retrieved Dec 7, 2016.
  2. ^ "STMicroelectronics To Acquire Genesis Microchip".
  3. ^ "Archived copy". Archived from the original on January 1, 2014. Retrieved July 15, 2013.CS1 maint: Archived copy as title (link)
  4. ^ glen (2009-02-17). "CSR-SiRF Merger Pairs Struggling Bluetooth and GPS Powerhouses - and Shows Handset Platform Dominance". Inside GNSS. Retrieved 2019-05-27.
  5. ^ a b "Archived copy". Archived from the original on 2013-01-21. Retrieved 2011-07-27.CS1 maint: Archived copy as title (link)
  6. ^ "About us – General Information – ST-Ericsson". Archived from the original on 23 December 2010. Retrieved 24 February 2011.
  7. ^ "2014 Annual Report". STMicroelectronics. 26 March 2015. Retrieved 20 February 2016.
  8. ^ "Company Information - STMicroelectronics". STMicroelectronics. Retrieved 2011-05-04. ST operates a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants
  9. ^ "ST Microelectronics announces investment in Malta". 29 June 2010. Retrieved 2013-07-10.
  10. ^ AMS sells NFC and RFID business to STMicroelectronics – NFC World. Retrieved on 2018-10-23.
  11. ^ a b c "Archived copy". Archived from the original on July 13, 2007. Retrieved July 11, 2007.CS1 maint: Archived copy as title (link)
  12. ^ STMicroelectronics to close Ottawa plant - Archives - Ottawa Business Journal. (2001-05-31). Retrieved on 2013-12-08.
  13. ^ STMicroelectronics to close Aztec West Business Park site Archived July 13, 2013, at the Wayback Machine BBC News
  14. ^ "Archived copy". Archived from the original on August 16, 2007. Retrieved August 14, 2007.CS1 maint: Archived copy as title (link)
  15. ^ "About us". 4 December 2013. Retrieved 5 July 2016.
  16. ^ "Nokia lines up chip transfer to ST - Electronics Weekly". 8 August 2007. Retrieved 5 July 2016.
  17. ^ "Loading". Retrieved 2013-07-10.

External links


ARM7 is a group of older 32-bit RISC ARM processor cores licensed by ARM Holdings for microcontroller use. The ARM7 core family consists of ARM700, ARM710, ARM7DI, ARM710a, ARM720T, ARM740T, ARM710T, ARM7TDMI, ARM7TDMI-S, ARM7EJ-S. The ARM7TDMI and ARM7TDMI-S were the most popular cores of the family. Since ARM7 cores were released from 1993 to 2001, they are no longer recommended for new IC designs; instead ARM Cortex-M or ARM Cortex-R cores are preferred.


ARM9 is a group of older 32-bit RISC ARM processor cores licensed by ARM Holdings for microcontroller use. The ARM9 core family consists of ARM9TDMI, ARM940T, ARM9E-S, ARM966E-S, ARM920T, ARM922T, ARM946E-S, ARM9EJ-S, ARM926EJ-S, ARM968E-S, ARM996HS. Since ARM9 cores were released from 1998 to 2006, they are no longer recommended for new IC designs, instead ARM Cortex-A, ARM Cortex-M , ARM Cortex-R cores are preferred.

ARM Cortex-R

The ARM Cortex-R is a family of 32-bit RISC ARM processor cores licensed by Arm Holdings. The cores are optimized for hard real-time and safety-critical applications. Cores in this family implement the ARM Real-time (R) profile, which is one of three architecture profiles, the other two being the Application (A) profile implemented by the Cortex-A family and the Microcontroller (M) profile implemented by the Cortex-M family. The ARM Cortex-R family of microprocessors currently consists of ARM Cortex-R4(F), ARM Cortex-R5(F), ARM Cortex-R7(F), ARM Cortex-R8(F), and ARM Cortex-R52(F).

C166 family

The C166 family is a 16-bit microcontroller architecture from Infineon (formerly the semiconductor division of Siemens) in cooperation with STMicroelectronics. It was first released in 1993 and is a controller for measurement and control tasks. It uses the well-established RISC architecture, but features some microcontroller-specific extensions such as bit-addressable memory and an interrupt system optimized for low-latency. When this architecture was introduced the main focus was to replace 8051 controllers (from Intel).

Opcode compatible successors of the C166 family are the C167 family, XC167 family, the XE2000 family and the XE166 family.

As of 2017, microcontrollers using the C166 architecture are still being manufactured by NIIET in Voronesh, Russia, as part of the 1887 series of integrated circuits. This includes a radiation-hardened device under the designation 1887VE6T (Russian: 1887ВЕ6Т).

Ericsson Mobile Platforms

Ericsson Mobile Platforms (EMP) was the name of a company within the Ericsson group that supplied mobile platforms, i.e. the technological basis on which a cellular phone product can be built. The main office was in Lund, Sweden.

EMP was one of the leading suppliers of 3G technology to various brands of phones. EMP did not manufacture chips themselves, but partnered with manufacturers that made them based on their reference design and Intellectual Property Rights. These chips were then only sold to EMP customers. According to the company, EMP held the world’s largest 2G, 2.5G and 3G IPR portfolio, with more than 20,000 granted patents worldwide.

Institut supérieur d'électronique de Paris

ISEP, short for "Institut supérieur d’électronique de Paris", is a French Grande école located in Paris. It specializes in electronics, telecommunication and computer science. ISEP cultivates engineers of today and tomorrow, in the key areas of IT world:

Computer science & Cybersecurity – Electronics & Robotics – Telecommunications & Internet of Things (IoT) – Imaging & Health – Artificial Intelligence

The school was founded in 1955 on the place where Édouard Branly, physics professor at the Catholic University of Paris, discovered the coherer in 1890.

The school has two campuses, one in paris in the 6ème - located in the heart of Paris, next to the “Quartier Latin”, one in an outskirt named Issy les Moulineaux.

ISEP has three main departments (Electronics, Telecommunication, Information systems) and ten laboratories for teaching and research. ISEP has relationships with several companies in its industry (Thales, STMicroelectronics, ATMEL) and has a strong worldwide program orientation (co-operation agreements with more than 20 international institutions, member of 3 international exchange programs). ISEP also initiated an International master's degree program. ISEP welcomes a diverse range of international students at both undergraduate and postgraduate levels.

It is one amongst the top four Grandes écoles according to the French magazines l'Express and L'Étudiant in 2010. In 2015, the school was ranked best in France for "digital" related subject and best overall private school by l'Usine Nouvelle.. In 2018, ISEP was ranked at the top of the podium by L’Etudiant magazine (out of 174 institutions) for the criteria “Making a good living in information technology”. This underlines ISEP’s excellence, the strength of its engineering degree and its proximity to businesses and the professional world.

List of ARM Cortex-M development tools

This is a list of development tools for 32-bit ARM Cortex-M-based microcontrollers, which consists of Cortex-M0, Cortex-M0+, Cortex-M1, Cortex-M3, Cortex-M4, Cortex-M7, Cortex-M23, Cortex-M33 cores.


Nomadik is a family of microprocessors for multimedia applications from STMicroelectronics. It is based on ARM9 ARM architecture and was designed specifically for mobile devices.

On December 12, 2002, STMicroelectronics and Texas Instruments jointly announced an initiative for Open Mobile Application Processor Interfaces (OMAPI) intended to be used with 2.5 and 3G mobile phones, that were going to be produced during 2003. (This was later merged into a larger initiative and renamed the MIPI alliance.) The Nomadik was STMicroelectronics' implementation of this standard.

Nomadik was first presented on October 7, 2003 in the CEATEC show in Tokyo, and later that year the Nomadik won the Microprocessor Report Analysts' Choice Award for application processors.The family was aimed at 2.5G/3G mobile phones, personal digital assistants and other portable wireless products with multimedia capability. In addition it was suitable for automotive multimedia applications. The most known device using the Nomadik processor was the Nokia N96 which used the STn8815 version of the chip. When the N96 debuted in 2008, the absence of a GPU was noticed.


NovaThor was a platform consisting of integrated System on Chips (SoC) and modems for smartphones and tablets developed by ST-Ericsson, a 50/50 joint venture of Ericsson and STMicroelectronics established on February 3, 2009. ST-Ericsson also sold the SoCs (Nova) and the modems (Thor) separately. The application processor portion of the system was the successor of the previous Nomadik line from STMicroelectronics.


Numonyx was a semiconductor company making flash memories, which was founded on March 31, 2008, by Intel Corporation, STMicroelectronics and Francisco Partners. It was acquired by Micron Technology on February 9, 2010.Numonyx was created from the key assets of businesses that in 2006, generated approximately $3.6 billion in combined annual revenue. The company supplies non-volatile memory for a variety of consumer and industrial devices including cellular phones, MP3 players, digital cameras, computers and other high-tech equipment.


The OMAP (Open Multimedia Applications Platform) family, developed by Texas Instruments, was a series of image/video processors. They are proprietary system on chips (SoCs) for portable and mobile multimedia applications. OMAP devices generally include a general-purpose ARM architecture processor core plus one or more specialized co-processors. Earlier OMAP variants commonly featured a variant of the Texas Instruments TMS320 series digital signal processor.

The platform was created after December 12, 2002, as STMicroelectronics and Texas Instruments jointly announced an initiative for Open Mobile Application Processor Interfaces (OMAPI) intended to be used with 2.5 and 3G mobile phones, that were going to be produced during 2003. (This was later merged into a larger initiative and renamed the MIPI Alliance.) The OMAP was Texas Instruments' implementation of this standard. (The STMicroelectronics implementation was named Nomadik.)

OMAP did enjoy some success in the smartphone and tablet market until 2011 when it lost ground to Qualcomm Snapdragon. On September 26, 2012, Texas Instruments announced they would wind down their operations in smartphone and tablet oriented chips and instead focus on embedded platforms. On November 14, 2012, Texas Instruments announced they would cut 1,700 jobs due to their shift from mobile to embedded platforms. The last OMAP5 chips were released in Q2 2013.

PowerPC 5000

The PowerPC 5000 family is a series of PowerPC and Power ISA microprocessors from Freescale (previously Motorola) and STMicroelectronics designed for automotive and industrial microcontroller and system on a chip (SoC) use. The MPC5000 family consists of two lines (51xx/52xx and 55xx/56xx) that really don't share a common heritage.


ST-Ericsson was a multinational manufacturer of wireless products and semiconductors, supplying to mobile device manufacturers. ST-Ericsson was a 50/50 joint venture of Ericsson and STMicroelectronics established on 3 February 2009 and dissolved 2 August 2013. Headquartered in Geneva, Switzerland, it was a fabless company, outsourcing semiconductor manufacturing to foundry companies.

Both Ericsson and STMicroelectronics appointed four directors to the board with Hans Vestberg, President and CEO of Ericsson, serving as the chairman of the board and Carlo Bozotti, President and CEO of STMicroelectronics, as the vice-chairman.

ST6 and ST7

The ST6 and ST7 are 8-bit microcontroller product lines from STMicroelectronics. They are commonly used in small embedded applications like washing machines.

Although they use similar peripherals and are marketed as part of the same product line, the two architectures are actually quite different.

Both have an 8-bit accumulator used for most operations, plus two 8-bit index registers (X and Y) used for memory addressing. Also both have 8-bit instructions followed by up to 2 bytes of operands, and both have support for manipulating and branching on individual bits of memory.

There, the similarities end.

The ST6 is a Harvard architecture with an 8-bit (256 byte) data address space and a separate 12-bit (4096 byte) program space. Operands are always 1 byte long, and some instructions support two operands, such as "move 8-bit immediate to 8-bit memory address". Subroutine calls are done using a separate hardware stack. Data registers (but not the program counter or flags) are memory-mapped.

The ST6's addressing modes are limited to immediate, 8-bit absolute memory address, and register indirect modes (X) and (Y).

The ST7 is a von Neumann architecture with a single 16-bit (64 kiB) address space. The first 256 bytes of RAM (the zero page) have extra flexibility. There are no two-operand instructions except for "test bit and branch". Its registers are not memory-mapped, and it uses general-purpose RAM (plus a stack pointer register) for subroutine calls.

The ST7 supports a wide variety of addressing modes, including base+index and double-indirect.


STM32 is a family of 32-bit microcontroller integrated circuits by STMicroelectronics. The STM32 chips are grouped into related series that are based around the same 32-bit ARM processor core, such as the Cortex-M33F, Cortex-M7F, Cortex-M4F, Cortex-M3, Cortex-M0+, or Cortex-M0. Internally, each microcontroller consists of the processor core, static RAM, flash memory, debugging interface, and various peripherals.

Settimo Milanese

Settimo Milanese (Milanese: Settim [ˈsɛtim]) is a comune (municipality) in the Province of Milan in the Lombardy region of Italy. It is about 9 kilometres (6 mi) west of Milan.

The industrial district of Castelletto is home to Italtel and STMicroelectronics.

Settimo Milanese borders Rho, Milan, Cornaredo, and Cusago.


TO-126 is a type of semiconductor package for devices with three pins, such as transistors. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a heat sink.

STMicroelectronics refers to this package style as SOT-32.

USB Implementers Forum

The USB Implementers Forum (USB-IF) is a not-for-profit organization created to promote and support the Universal Serial Bus. Its main activities are the promotion and marketing of USB, Wireless USB, USB On-The-Go, and the maintenance of the specifications, as well as a compliance program.

It was formed in 1995 by the group of companies that developed USB. Those founding companies were Compaq, Digital, IBM PC Co, Intel, Microsoft, NEC and Nortel. Notable members include Hewlett-Packard, NEC, Microsoft, Apple Inc., Intel, and Agere Systems.

The working committees within USB-IF are:

Device Working Group

Compliance Committee

Marketing CommitteeThe USB-IF web caters to developers who can freely sign up to the developer web-forums and access documentation, however to join a working group one has to work for a member company or register as a member. The developer forums cover USB hardware and software development and are not an end-user forums.

In 2014, they announced a USB connection called "USB Type-C". It transfers data with rates up to 10 Gbit/s and provides up to 100 Watts of power.The board of directors consists of Apple, HP Inc., Intel Corporation, Microsoft Corporation, Renesas Electronics, STMicroelectronics, and Texas Instruments.


wolfSSL is a small, portable, embedded SSL/TLS library targeted for use by embedded systems developers. It is an open source implementation of TLS (SSL 3.0, TLS 1.0, 1.1, 1.2, 1.3, and DTLS 1.0 and 1.2) written in the C programming language. It includes SSL/TLS client libraries and an SSL/TLS server implementation as well as support for multiple APIs, including those defined by SSL and TLS. wolfSSL also includes an OpenSSL compatibility interface with the most commonly used OpenSSL functions.A predecessor of wolfSSL, yaSSL is a C++ based SSL library for embedded environments and real time operating systems with constrained resources.

FTSE MIB companies of Italy
CAC 40 companies of France (as of 4 October 2017)


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